Circuits are analysed using mainly ORCAD's PSPICE tool which is upward
compatible to Cadence products.
We also use component manufacturer's simulation tools when model is not
available for PSPICE. This might be the case with a few power devices by Linear
Technology. Their LTSpice is available from their web site; it is a free tool.
Various analyses are possible, a few arelisted below:
Simulation and Analysis
- Bode plots of key performance parameters
- Timing analysis
- Mixed signal simulation
- Transient analysis
- Stability analysis (Phase margin, Gain margin)
Many other analyses can be arranged for.
The Worst Case Analysis is captured in MS Word format and is a document we
can produce if requested. The component values and their changes over
temperature is calculated in a statistical way and their spread -typically a
Gaussian distribution- is recorded in the document. The main contributor to
component value change is temperature -which is a result of DC and AC operating
points- as well as initial value tolerances.
The Worst Case Analysis can identify a component in your design that might be
overstressed, leading to early circuit failure.
Similarly to the Worst Case Analysis, the Part Stress Analysis can be performed
upon request and is performed on all the components of your circuit. The purpose
of this analysis is to assure that none of the components are operating beyond
their intended parameter. The analysis typically includes:
- Semiconductor break down voltages (Vce, Vbe,Vbias, Voffset, Qgc, etc.)
- semiconductor power dissipation
- passive device voltage, current and power rating
Other parameters can be included based on how the actual part is used in the
This document is in a form of Excel spred sheet, listing all the components, the
parameter of interest, the component's maximum allowed stress and the actual
stress. A PASS/FAIL column identifies if the part is overstressed.
Safety margin value -if any- is also listed
Phone: (519) 489 7082